Symbol, Footprint, 3D ModelSpecifications
- StatusActive
- TechnologyPlanar
- FamilyHigh Efficient
- PackageThinDPAK
- MSL1
- AEC-QYes
- TJ Max. (°C)175
- trr (ns)60
- IF(AV) (A)6
- VRRM (V)600
- IFSM (A)100
- VF (V)1.3
- IR (µA)5
DataSheet
- DataSheet
Resources
Tools
Technical Library
- Spice Model
Reliability
- Whisker Report
Additional information
- Product Shelf Life
- Material Composition Declaration
